Advanced AI Software for Semiconductor Metrology

JUST CLICK... AND THAT’S IT

Quartz Imaging has been providing metrology tools to the semiconductor industry for more than 30 years.

Our Artificial Intelligence driven Quartz PCI-AM product offers three levels of automation for semiconductor metrology in electron microscope images.

The first level allows you to simply click inside a device feature and it will be automatically measured in accordance with a "recipe" that has been set up.

With the second level of automation, you can fully characterize a complete image with a single click.

The third and most powerful level of automation allows you to automatically characterize an entire folder of images based on a template image that you have measured.

So, whether you need to measure one image, a small batch, or thousands of images, using Quartz PCI-AM can be a huge time saver.

PDF Icon Quartz PCI-AM Product Sheet
Quartz PCI-AM

Automated Semiconductor Metrology

PCI-AM performs metrology in both cross-section and top view images from SEMs (X-SEM) and TEMs in semiconductor laboratory, process development and engineering environments. Multiple edge detection techniques are employed depending on the nature and source of the images, including our most recently introduced Advanced Model based on deep learning. This is vastly different from other tools designed for in-line metrology using top view images.

Very little set-up is required before you can be making fast, efficient automatic image measurements. Therefore, it is practical to use the PCI-AM tools to measure individual images and as an aid to manual measurements, in addition to being able to measure large batches of images.

Not only does PCI-AM save time, it also improves measurement consistency among multiple users because the edges and measurement points are determined automatically by the system rather than by human judgment.

What's NEW in QUARTZ PCI-AM 8

  • Improved Edge Detection – better edge detection, particularly for TEM images
  • Image Auto Rotation – automatically orient features horizontally and vertically for ease of measurement
  • Measurement Tolerances – measurements can be checked against user-specified tolerances
  • Auto Layer Detection and Measurement – if needed these lines can be moved
  • Add Additional Reference Lines – assist in making desired measurements

PCI-AM Benefits

  • Save Time
  • Increase Measurement Consistency
  • Generate Reports Easily with Images and Data
  • Increase Measurement Accuracy
  • Export Data Easily into CSV File

TYPES OF AUTOMATED MEASUREMENTS

Trenches (Spaces) and Pillars (Lines)

  • CD Width
  • Angles – Sidewall and Center
  • Multiple Regions in Feature
  • Line Edge Roughness
  • Line Width Roughness
  • Distances Below and Above Reference Line
  • Averages of the Above Measurements
Trench Measurements
Trench Measurements

Macro Cell

  • Multiple Measurements in Complex Features with a Single Click
Macro Cell
Macro Cell

Shapes

  • Area and Perimeter
  • Aspect Ratio
  • Major and Minor Axes
  • Collinearity
  • Ideal Shape Deviation
  • Tilt
Shape Measurements
Shape Measurements
More on Quartz PCI-AM

Other Valuable PCI-AM Features

  • "Point and Shoot" Horizontal and Vertical Measurement Tools Utilize Edges
  • Regular PCI Measurement Tools will "Snap" to the Edges in PCI-AM
  • Predetermine the Number and Exact Location of CD Measurements Relative to the Reference Line
  • Advance Edge Detection Model